中華人民共和國國家標準(中國大陸GB標準)英文版

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	GB/T 35006-2018 半导体集成电路电平转换器测试方法（中英文版） Semiconductor integrated circuits—Measuring method of level converter
	GB/T 35007-2018 半导体集成电路低电压差分信号电路测试方法（中英文版） Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
	GB/T 36600.11-2018 全国主要产品分类产品类别核心元数据第11部分：磁卡与集成电路卡（中英文版） National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card
	GB/T 15879.5-2018 半导体器件的机械标准化第5部分：用于集成电路载带自动焊(TAB)的推荐值（中英文版） Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
	GB/T 36477-2018 半导体集成电路快闪存储器测试方法（中英文版） Semiconductor integrated circuit—Measuring methods for flash memory
	GB/T 36479-2018 集成电路焊柱阵列试验方法（中英文版） Integrated circuits—Test methods for column grid array
	GB/T 36474-2018 半导体集成电路第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法（中英文版） Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)
	GB/T 37600.11-2018 全国主要产品分类-产品类别核心元数据-第11部分：磁卡与集成电路卡（中英文版） National central product classification—Product category core metadata—Part 11：Magnetic stripe card and integrated circuit card
	GB/T 13062-2018 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)（中英文版） Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
	GB/T 11498-2018 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)（中英文版） Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
	GB/T 36636-2018 识别卡双界面集成电路卡模块规范（中英文版） Identification cards—Specification for dual-interface integrated circuit card module
	GB/T 33140-2016 集成电路用磷铜阳极（中英文版） Phosphorized copper anode used for integrated circuit
	GB/T 4023-2015 半导体器件分立器件和集成电路第2部分：整流二极管（中英文版） Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes
	GB 51122-2015 集成电路封装测试厂设计规范（中英文版） Code for design of integrated circuit assembly and test factory
	GB/T 16525-2015 半导体集成电路塑料有引线片式载体封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
	GB/T 15878-2015 半导体集成电路小外形封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of leadframes for small outline package
	GB/T 15876-2015 半导体集成电路塑料四面引线扁平封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package
	GB/T 14112-2015 半导体集成电路塑料双列封装冲制型引线框架规范（中英文版） Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
	GB/T 29271.3-2014 识别卡集成电路卡编程接口第3部分：应用接口（中英文版） Identification cards—Integrated circuit card programming interfaces—Part 3: Application interface
	GB/T 30962-2014 识别卡集成电路卡大容量卡（中英文版） Identification cards―Integrated circuit cards―High capacity cards
	GB/T 15877-2013 半导体集成电路蚀刻型双列封装引线框架规范（中英文版） Semiconductor integrated circuits—Specification of DIP leadframes produced by etching
	GB/T 14620-2013 薄膜集成电路用氧化铝陶瓷基片（中英文版） Alumina ceramic substrates for thin film integrated circuits
	GB/T 14619-2013 厚膜集成电路用氧化铝陶瓷基片（中英文版） Alumina ceramic substrates for thick film integrated circuits
	GB/T 16649.13-2013 识别卡集成电路卡第13部分：在多应用环境中的应用管理命令（中英文版） Identification cards - Integrated circuit cards - Part 13: Commands for application management in a multi-application environment
	GB/T 29271.1-2012 识别卡集成电路卡编程接口第1部分：体系结构（中英文版） Identification cards - Integrated circuit card programming interfaces - Part 1: Architecture
	GB/T 29271.2-2012 识别卡集成电路卡编程接口第2部分：通用卡接口（中英文版） Identification card - Integrated circuit card programming interfaces - Part 2: Generic card interface
	GB 50809-2012 硅集成电路芯片工厂设计规范（中英文版） Code for design of silicon integrated circuits wafer fab
	GB/T 28511.2-2012 平面光波导集成光路器件第2部分：基于阵列波导光栅（AWG）技术的密集波分复用（DWDM）滤波器（中英文版） Integrated optical path devices based on planar lightwave circuit - Part 2 ：DWDM filter based on AWG technology
	GB/T 28511.1-2012 平面光波导集成光路器件第1部分：基于平面光波导（PLC）的光功率分路器（中英文版） Integrated optical path devices based on planar lightwave circuit - Part 1：Optical power splitter based on PLC technology
	GB/T 15157.12-2011 频率低于3MHz的印制板连接器第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范（中英文版） Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
	GB/T 16649.15-2010 识别卡集成电路卡第15部分：密码信息应用（中英文版） Identification cards - Integrated circuit cards - Part 15: Cryptographic information application
	GB/T 22351.2-2010 识别卡无触点的集成电路卡邻近式卡第2部分：空中接口和初始化（中英文版） Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization
	GB/T 16649.12-2010 识别卡集成电路卡第12部分：带触点的卡-USB电气接口和操作规程（中英文版） Identification cards - Integrated circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures
	GB/T 16649.9-2010 识别卡集成电路卡第9部分：用于卡管理的命令（中英文版） Identification cards - Integrated circuit cards - Part 9: Commands for card management
	GB/T 16649.4-2010 识别卡集成电路卡第4部分：用于交换的结构、安全和命令（中英文版） Identification Cards - Integrated circuit cards - Part 4: Organization, security and commands for interchange
	GB/T 22351.3-2008 识别卡无触点的集成电路卡邻近式卡第3部分：防冲突和传输协议（中英文版） Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol
	GB/T 22351.1-2008 识别卡无触点的集成电路卡邻近式卡第1部分：物理特性（中英文版） Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics
	GB/T 20870.1-2007 半导体器件第16-1部分：微波集成电路放大器（中英文版） Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
	GB/T 17574.9-2006 半导体器件集成电路第2-9部分：数字集成电路紫外光擦除电可编程MOS只读存储器空白详细规范（中英文版） Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
	GB/T 17574.20-2006 半导体器件集成电路第2-20部分：数字集成电路低压集成电路族规范（中英文版） Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits
	GB/T 17574.11-2006 半导体器件集成电路第2-11部分：数字集成电路单电源集成电路电可擦可编程只读存储器空白详细规范（中英文版） Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
	GB/T 4589.1-2006 半导体器件第10部分：分立器件和集成电路总规范（中英文版） Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
	GB/T 20515-2006 半导体器件集成电路第5部分：半定制集成电路（中英文版） Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
	GB/T 16790.6-2006 金融交易卡使用集成电路卡的金融交易系统的安全体系第6部分：持卡人身份验证（中英文版） Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 6: Cardholder verification
	GB/T 16790.5-2006 金融交易卡使用集成电路卡的金融交易系统的安全体系第5部分：算法应用（中英文版） Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 5: Use of algorithms
	GB/T 16790.7-2006 金融交易卡使用集成电路卡的金融交易系统的安全体系第7部分：密钥管理（中英文版） Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 7: Key management
	GB/T 12750-2006 半导体器件集成电路第11部分：半导体集成电路分规范(不包括混合电路)（中英文版） Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
	GB/T 17554.3-2006 识别卡测试方法第3部分:带触点的集成电路卡及其相关接口设备（中英文版） Identification cards - Test methods Part 3: Integrated circuit(s) cards with contacts and related interface devices
	GB/T 16649.3-2006 识别卡带触点的集成电路卡第3部分:电信号和传输协议（中英文版） Identification cards - Integrated circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols
	GB/T 16649.2-2006 识别卡带触点的集成电路卡第2部分:触点的尺寸和位置（中英文版） Identification cards - Integrated circuit(s) cards with contacts - Part 2: Dimensions and location of the contacts

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