中華人民共和國國家標準(中國大陸GB標準)英文版 |
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GB/T 42970-2023 半导体集成电路 视频编解码电路测试方法(中英文版) Semiconductor integrated circuit video encoding and decoding circuit testing method |
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GB/T 20870.10-2023 半导体器件 第16-10部分:单片微波集成电路技术可接收程序(中英文版) Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures |
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GB/T 20870.2-2023 半导体器件 第16-2部分:微波集成电路 预分频器(中英文版) Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers |
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GB/T 20870.5-2023 半导体器件 第16-5部分:微波集成电路 振荡器(中英文版) Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators |
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GB/T 42968.8-2023 集成电路 电磁抗扰度测量 第8部分:辐射抗扰度测量 IC带状线法(中英文版) Integrated circuits - Electromagnetic immunity measurements - Part 8: Radiated immunity measurements - IC stripline method |
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GB/T 42973-2023 半导体集成电路 数字模拟(DA)转换器(中英文版) Semiconductor integrated circuit Digital-to-analog (DA) converter |
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GB/T 42974-2023 半导体集成电路 快闪存储器(FLASH)(中英文版) Semiconductor integrated circuit flash memory (FLASH) |
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GB/T 42975-2023 半导体集成电路 驱动器测试方法(中英文版) Semiconductor integrated circuit driver test methods |
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GB/T 43034.3-2023 集成电路 脉冲抗扰度测量 第3部分:非同步瞬态注入法(中英文版) Integrated circuits - Measurement of pulse immunity - Part 3: Non-synchronous transient injection method |
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GB/T 43035-2023 半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范 第一篇:内部目检要求(中英文版) Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements |
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GB/T 43040-2023 半导体集成电路 AC/DC变换器测试方法(中英文版) Semiconductor integrated circuit AC/DC converter test method |
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GB/T 43061-2023 半导体集成电路 PWM控制器测试方法(中英文版) Semiconductor integrated circuit PWM controller test method |
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GB/T 43063-2023 集成电路 CMOS图像传感器测试方法(中英文版) Integrated circuit CMOS image sensor test method |
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GB/T 43226-2023 宇航用半导体集成电路单粒子软错误时域测试方法(中英文版) Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications |
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GB/T 43227-2023 宇航用集成电路内引线气相沉积保护膜试验方法(中英文版) Test method for vapor-deposited protective films for inner leads of integrated circuits for aerospace use |
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GB/T 43228-2023 宇航用抗辐射加固集成电路单元库设计要求(中英文版) Design requirements for radiation-hardened integrated circuit unit libraries for aerospace use |
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GB/T 42968.1-2023 集成电路 电磁抗扰度测量 第1部分:通用条件和定义(中英文版) Integrated circuits - Electromagnetic immunity measurements - Part 1: General conditions and definitions |
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GB/T 43041-2023 混合集成电路 直流/直流(DC/DC)变换器(中英文版) Hybrid integrated circuit DC/DC converter |
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GB/T 42848-2023 半导体集成电路 直接数字频率合成器测试方法(中英文版) Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers |
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GB/T 42835-2023 半导体集成电路 片上系统(SoC)(中英文版) Semiconductor integrated circuit system on chip (SoC) |
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GB/T 42836-2023 微波半导体集成电路 混频器(中英文版) Microwave semiconductor integrated circuit mixer |
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GB/T 42837-2023 微波半导体集成电路 放大器(中英文版) Microwave semiconductor integrated circuit amplifier |
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GB/T 42838-2023 半导体集成电路 霍尔电路测试方法(中英文版) Semiconductor integrated circuit Hall circuit test method |
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GB/T 42839-2023 半导体集成电路 模拟数字(AD)转换器(中英文版) Semiconductor integrated circuit Analog-to-digital (AD) converter |
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GB/T 43536.1-2023 三维集成电路 第1部分:术语和定义(中英文版) Three-dimensional integrated circuits Part 1: Terms and definitions |
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GB/T 43454-2023 集成电路知识产权(IP)核设计要求(中英文版) Integrated circuit intellectual property (IP) core design requirements |
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GB/T 28511.2-2023 平面光波导集成光路器件 第2部分:基于阵列波导光栅(AWG)技术的密集波分复用(DWDM)滤波器(中英文版) Planar optical waveguide integrated optical circuit devices Part 2: Dense wavelength division multiplexing (DWDM) filters based on arrayed waveguide grating (AWG) technology |
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GB/Z 43510-2023 集成电路TSV三维封装可靠性试验方法指南(中英文版) Guide to Reliability Test Methods for Integrated Circuit TSV Three-Dimensional Packages |
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GB/T 43538-2023 集成电路金属封装外壳质量技术要求(中英文版) Quality technical requirements for integrated circuit metal packaging casing |
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GB/T 43536.2-2023 三维集成电路 第2部分:微间距叠层芯片的校准要求(中英文版) Three-dimensional integrated circuits Part 2: Calibration requirements for fine-pitch stacked chips |
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GB/T 41325-2022 集成电路用低密度晶体原生凹坑硅单晶抛光片(中英文版) Low-density crystal primary pit silicon single crystal polishing wafer for integrated circuits |
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GB/T 7092-2021 半导体集成电路外形尺寸(中英文版) Outline dimensions of semiconductor integrated circuits |
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GB/T 41213-2021 集成电路用全自动装片机(中英文版) Integrated circuit full automatic die bonder |
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GB/T 40577-2021 集成电路制造设备术语(中英文版) Terminology for integrated circuit(IC) manufacturing equipment |
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GB/T 39679-2020 电梯IC卡装置(中英文版) Integrated circuit card device for lifts |
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GB/T 39159-2020 集成电路用高纯铜合金靶材(中英文版) High purity copper alloy target for integrated circuit |
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GB/T 29271.6-2019 识别卡 集成电路卡编程接口 第6部分:实现互操作的鉴别协议的注册管理规程(中英文版) Identification cards—Integrated circuit card programming interfaces—Part 6: Registration authority procedures for the authentication protocols for interoperability |
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GB/T 16649.11-2019 识别卡 集成电路卡 第11部分:通过生物特征识别方法的身份验证(中英文版) Identification cards—Integrated circuit cards—Part 11: Personal verification through biometric methods |
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GB/T 29271.4-2019 识别卡 集成电路卡编程接口 第4部分:应用编程接口(API)管理(中英文版) Identification cards—Integrated circuit card programming interfaces—Part 4: Application programming interface (API) administration |
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GB/T 37312.1-2019 航空电子过程管理 航空航天、国防及其他高性能应用领域(ADHP)电子元器件 第1部分:高可靠集成电路与分立半导体器件通用要求(中英文版) Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
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GB/T 15879.5-2018 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值(中英文版) Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits |
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GB/T 4377-2018 半导体集成电路 电压调整器测试方法(中英文版) Semiconductor integrated circuits—Measuring method of voltage regulators |
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GB/T 14028-2018 半导体集成电路 模拟开关测试方法(中英文版) Semiconductor integrated circuits—Measuring method of analogue switch |
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GB/T 35005-2018 集成电路倒装焊试验方法(中英文版) Test methods for flip chip integrated circuits |
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GB/T 35004-2018 数字集成电路 输入/输出电气接口模型规范(中英文版) Logic digital integrated circuits—Specification for I/O interface model for integrated circuit |
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GB/T 35006-2018 半导体集成电路 电平转换器测试方法(中英文版) Semiconductor integrated circuits—Measuring method of level converter |
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GB/T 35007-2018 半导体集成电路 低电压差分信号电路测试方法(中英文版) Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry |
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GB/T 36636-2018 识别卡 双界面集成电路卡模块规范(中英文版) Identification cards—Specification for dual-interface integrated circuit card module |
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GB/T 36614-2018 集成电路 存储器引出端排列(中英文版) Integrated circuits—Memory devices pin configuration |
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GB/T 36477-2018 半导体集成电路 快闪存储器测试方法(中英文版) Semiconductor integrated circuit—Measuring methods for flash memory |
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GB/T 36479-2018 集成电路 焊柱阵列试验方法(中英文版) Integrated circuits—Test methods for column grid array |
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GB/T 36474-2018 半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法(中英文版) Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) |
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GB/T 37600.11-2018 全国主要产品分类-产品类别核心元数据-第11部分:磁卡与集成电路卡(中英文版) National central product classification—Product category core metadata—Part 11:Magnetic stripe card and integrated circuit card |
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GB/T 13062-2018 半导体器件-集成电路-第21-1部分:膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)(中英文版) Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 11498-2018 半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)(中英文版) Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
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GB/T 36600.11-2018 全国主要产品分类 产品类别核心元数据 第11部分:磁卡与集成电路卡(中英文版) National central product classification—Product category core metadata—Part 11:Magnetic stripe card and integrated circuit card |
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GB/T 33140-2016 集成电路用磷铜阳极(中英文版) Phosphorized copper anode used for integrated circuit |
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GB/T 4023-2015 半导体器件 分立器件和集成电路 第2部分:整流二极管(中英文版) Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes |
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GB 51122-2015 集成电路封装测试厂设计规范(中英文版) Code for design of integrated circuit assembly and test factory |
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GB/T 16525-2015 半导体集成电路 塑料有引线片式载体封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package |
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GB/T 15878-2015 半导体集成电路 小外形封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of leadframes for small outline package |
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GB/T 15876-2015 半导体集成电路 塑料四面引线扁平封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package |
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GB/T 14112-2015 半导体集成电路 塑料双列封装冲制型引线框架规范(中英文版) Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP |
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GB/T 29271.3-2014 识别卡 集成电路卡编程接口 第3部分:应用接口(中英文版) Identification cards—Integrated circuit card programming interfaces—Part 3: Application interface |
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GB/T 30962-2014 识别卡 集成电路卡 大容量卡(中英文版) Identification cards―Integrated circuit cards―High capacity cards |
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GB/T 15877-2013 半导体集成电路 蚀刻型双列封装引线框架规范(中英文版) Semiconductor integrated circuits—Specification of DIP leadframes produced by etching |
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GB/T 16649.13-2013 识别卡 集成电路卡 第13部分:在多应用环境中的应用管理命令(中英文版) Identification cards - Integrated circuit cards - Part 13: Commands for application management in a multi-application environment |
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GB/T 14620-2013 薄膜集成电路用氧化铝陶瓷基片(中英文版) Alumina ceramic substrates for thin film integrated circuits |
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GB/T 14619-2013 厚膜集成电路用氧化铝陶瓷基片(中英文版) Alumina ceramic substrates for thick film integrated circuits |
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GB/T 29271.2-2012 识别卡 集成电路卡编程接口 第2部分:通用卡接口(中英文版) Identification card - Integrated circuit card programming interfaces - Part 2: Generic card interface |
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GB/T 29271.1-2012 识别卡 集成电路卡编程接口 第1部分:体系结构(中英文版) Identification cards - Integrated circuit card programming interfaces - Part 1: Architecture |
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GB 50809-2012 硅集成电路芯片工厂设计规范(中英文版) Code for design of silicon integrated circuits wafer fab |
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GB/T 28511.2-2012 平面光波导集成光路器件 第2部分:基于阵列波导光栅(AWG)技术的密集波分复用(DWDM)滤波器(中英文版) Integrated optical path devices based on planar lightwave circuit - Part 2 :DWDM filter based on AWG technology |
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GB/T 28511.1-2012 平面光波导集成光路器件 第1部分:基于平面光波导(PLC)的光功率分路器(中英文版) Integrated optical path devices based on planar lightwave circuit - Part 1:Optical power splitter based on PLC technology |
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GB/T 15157.12-2011 频率低于3MHz的印制板连接器 第12部分:集成电路插座的尺寸、一般要求和试验方法详细规范(中英文版) Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
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GB/T 16649.4-2010 识别卡 集成电路卡 第4部分:用于交换的结构、安全和命令(中英文版) Identification Cards - Integrated circuit cards - Part 4: Organization, security and commands for interchange |
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GB/T 16649.15-2010 识别卡 集成电路卡 第15部分:密码信息应用(中英文版) Identification cards - Integrated circuit cards - Part 15: Cryptographic information application |
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GB/T 22351.2-2010 识别卡 无触点的集成电路卡 邻近式卡 第2部分:空中接口和初始化(中英文版) Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part2: Air interface and initialization |
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GB/T 16649.12-2010 识别卡 集成电路卡 第12部分:带触点的卡-USB电气接口和操作规程(中英文版) Identification cards - Integrated circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures |
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GB/T 16649.9-2010 识别卡 集成电路卡 第9部分:用于卡管理的命令(中英文版) Identification cards - Integrated circuit cards - Part 9: Commands for card management |
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GB/T 22351.3-2008 识别卡 无触点的集成电路卡 邻近式卡 第3部分:防冲突和传输协议(中英文版) Identification cards - Contactless integrated circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol |
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GB/T 22351.1-2008 识别卡 无触点的集成电路卡 邻近式卡 第1部分:物理特性(中英文版) Identification cards - Contactless integrated circuit(s) cards - Vicinity cards - Part 1: Physical characteristics |
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GB/T 20870.1-2007 半导体器件 第16-1部分:微波集成电路 放大器(中英文版) Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
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GB/T 17574.9-2006 半导体器件 集成电路 第2-9部分:数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范(中英文版) Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories |
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GB/T 17574.20-2006 半导体器件 集成电路 第2-20部分:数字集成电路 低压集成电路族规范(中英文版) Semiconductor devices - Integrated circuits - Part 2-20:Digital integrated circuits - Family specification - Low voltage integrated circuits |
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GB/T 17574.11-2006 半导体器件 集成电路 第2-11部分:数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范(中英文版) Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory |
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GB/T 4589.1-2006 半导体器件 第10部分:分立器件和集成电路总规范(中英文版) Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
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GB/T 20515-2006 半导体器件 集成电路 第5部分:半定制集成电路(中英文版) Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits |
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GB/T 16790.7-2006 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第7部分:密钥管理(中英文版) Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 7: Key management |
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GB/T 16790.6-2006 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第6部分:持卡人身份验证(中英文版) Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 6: Cardholder verification |
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GB/T 16790.5-2006 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第5部分:算法应用(中英文版) Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 5: Use of algorithms |
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GB/T 12750-2006 半导体器件 集成电路 第11部分:半导体集成电路分规范(不包括混合电路)(中英文版) Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
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GB/T 17554.3-2006 识别卡 测试方法 第3部分:带触点的集成电路卡及其相关接口设备(中英文版) Identification cards - Test methods Part 3: Integrated circuit(s) cards with contacts and related interface devices |
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GB/T 16649.3-2006 识别卡 带触点的集成电路卡 第3部分:电信号和传输协议(中英文版) Identification cards - Integrated circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols |
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GB/T 16649.2-2006 识别卡 带触点的集成电路卡 第2部分:触点的尺寸和位置(中英文版) Identification cards - Integrated circuit(s) cards with contacts - Part 2: Dimensions and location of the contacts |
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GB/T 16649.1-2006 识别卡 带触点的集成电路卡 第1部分:物理特性(中英文版) Identification cards - Integrated circuit(s) cards with contacts - Part 1: Physical characteristics |
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GB/T 19558-2004 集成电路(IC)卡公用付费电话系统总技术要求(中英文版) General specifications for integrated circuit(IC)card payphone and system |
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GB/T 2900.66-2004 电工术语 半导体器件和集成电路(中英文版) Electrotechnical terminology--Semiconductor devices and integrated circuits |
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GB/T 15651.2-2003 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性(中英文版) Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics |
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GB/T 19403.1-2003 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路)(中英文版) Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) |
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GB/T 15651.3-2003 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法(中英文版) Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods |
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GB/T 17574.10-2003 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范(中英文版) Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories |
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GB/T 16649.5-2002 识别卡 带触点的集成电路卡 第5部分:应用标识符的国家编号体系和注册规程(中英文版) Identification cards--Integrated circuit(s) cards with contacts--Part 5:National numbering system and registration procedure for application identifiers |
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GB/T 18500.2-2001 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范(中英文版) Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) |
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GB/T 18500.1-2001 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范(中英文版) Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) |
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GB/T 18460.3-2001 IC卡预付费售电系统 第3部分:预付费电度表(中英文版) Pre-payment vending system using integrated circuit(s)cards with contacts--Part 3:Pre-payment elect-ricity meters |
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GB/T 18460.2-2001 IC卡预付费售电系统 第2部分:IC卡及其管理(中英文版) Pre-payment vending system using integrated circuit(s)cards with contacts--Part 2:IC card and its management |
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GB/T 18460.1-2001 IC卡预付费售电系统 第1部分:总则(中英文版) Pre-payment vending system using integrated circuit(s)cards with contacts--Part 1:General principles |
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GB/T 18392-2001 中华人民共和国组织机构代码证集成电路(IC)卡技术规范(中英文版) Norm of integrated circuit(IC) card of certificate of identity code for organizations institutions and enterprises of the People’s Republic of China |
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GB/T 18349-2001 集成电路/计算机硬件描述语言Verilog(中英文版) Integrated Circuit/Computer Hardware Description Language Verilog |
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GB/T 16649.6-2001 识别卡 带触点的集成电路卡 第6部分:行业间数据元(中英文版) Identification cards--Integrated circuit(s) cards with contacts--Part 6:Interindustrv data elements |
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GB/T 16649.7-2000 识别卡 带触点的集成电路卡 第7部分:用于结构化卡查询语言(SCQL)的行业间命令(中英文版) Identification cards--Integrated circuit(s) cards with contacts--Part 7:Interindustry commands for Structured Card Query Language(SCQL) |
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GB/T 18239-2000 集成电路(IC)卡读写机通用规范(中英文版) Generic specification for integrated circuit card reader |
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GB/T 5965-2000 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范(中英文版) Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) |
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GB/T 17940-2000 半导体器件 集成电路 第3部分:模拟集成电路(中英文版) Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits |
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GB/T 17801-1999 经公用交换电话网或综合业务数字网或电路交换公用数据网接入分组交换公用数据网的分组式数据终端设备(DTE)和数据电路终接设备(DCE)之间的接口(中英文版) Interface betweendata terminal equipment(DTE) and data circuit-terminating equipment (DCE) for terminals operating in the packet mode and accessing a packet switched public data network through a public switched telephone network or an integrated service |
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GB/T 17574-1998 半导体器件 集成电路 第2部分:数字集成电路(中英文版) Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits |
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GB/T 9424-1998 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范(中英文版) Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits,series 4000B and 4000UB |
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GB/T 17573-1998 半导体器件 分立器件和集成电路 第1部分:总则(中英文版) Semiconductor devices--Discrete devices and integrated circuits--Part 1:General |
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GB/T 17572-1998 半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范(中英文版) Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits,series 4000B and 4000UB |
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GB/T 4023-1997 半导体器件 分立器件和集成电路 第2部分:整流二极管(中英文版) Semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes |
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GB/T 17024-1997 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范(中英文版) Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU |
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GB/T 17023-1997 半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范(中英文版) Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU |
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GB/T 16878-1997 用于集成电路制造技术的检测图形单元规范(中英文版) Specification for metrology pattern cells for integrated circuit manufacture |
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GB/T 16791.1-1997 金融交易卡 集成电路卡与卡接受设备之间的报文 第1部分:概念与结构(中英文版) Financial transaction cards--Messages between the integrated circuit card and the card accepting device--Part 1:Concepts and structures |
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GB/T 16790.1-1997 金融交易卡 使用集成电路卡的金融交易系统的安全结构 第1部分:卡的生命周期(中英文版) Financial transaction cards--Security architecture of financial transaction systems using integrated circuit cards--Part 1:Card life cycle |
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GB/T 8976-1996 膜集成电路和混合膜集成电路总规范(中英文版) Generic specification for film integrated circuits and hybrid film integrated circuits |
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GB/T 16464-1996 半导体器件 集成电路 第1部分:总则(中英文版) Semiconductor devices--Integrated circuits--Part 1:General |
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GB/T 16465-1996 膜集成电路和混合膜集成电路分规范(采用能力批准程序)(中英文版) Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
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GB/T 16466-1996 膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序)(中英文版) Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
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GB/T 3436-1996 半导体集成电路 运算放大器系列和品种(中英文版) Semiconductor integrated circuits--Series and products of operational amplifier |
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GB/T 6798-1996 半导体集成电路 电压比较器测试方法的基本原理(中英文版) Semiconductor integrated circuits--General principles of measuring methods of voltage comparators |
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GB/T 4377-1996 半导体集成电路 电压调整器测试方法的基本原理(中英文版) Semiconductor integrated circuits--General principles of measuring methods of voltage regulator |
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GB/T 15879-1995 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值(中英文版) Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits |
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GB/T 15651-1995 半导体器件 分立器件和集成电路 第5部分:光电子器件(中英文版) Semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices |
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GB/T 4587-1994 半导体分立器件和集成电路 第7部分:双极型晶体管(中英文版) Semiconductor discrete devices and integrated circuits--Part 7:Bipolar transistors |
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GB/T 4376-1994 半导体集成电路 电压调整器系列和品种(中英文版) Series and products of voltage regulators for semi-conductor integrated circuits |
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GB/T 15138-1994 膜集成电路和混合集成电路外形尺寸(中英文版) Case outlines for film integrated circuits and hybrid integrated circuits |
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GB/T 15136-1994 半导体集成电路石英钟表电路测试方法的基本原理(中英文版) General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits |
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GB/T 14862-1993 半导体集成电路封装结到外壳热阻测试方法(中英文版) Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits |
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GB/T 14129-1993 半导体集成电路TTL电路系列和品种 PAL系列的品种(中英文版) Series and productsfor TTL semiconductor integrated circuits--Products of series PAL |
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GB/T 7092-1993 半导体集成电路外形尺寸(中英文版) Outline dimensions of semiconductor integratedcircuits |
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GB/T 14115-1993 半导体集成电路采样/保持放大器测试方法的基本原理(中英文版) General principles of measuring methods of Sample/Hold amplifiers for semiconductor integrated circuits |
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GB/T 14114-1993 半导体集成电路电压/频率和频率/电压转换器测试方法的基本原理(中英文版) General principles of measuring methods of V/F and F/V converters for semiconductor integrated circuits |
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GB/T 14029-1992 半导体集成电路模拟乘法器测试方法的基本原理(中英文版) General principles of measuring methods of analogue multiplier for semiconductor integrated circuits |
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GB/T 14028-1992 半导体集成电路模拟开关测试方法的基本原理(中英文版) General principles of measuring methods of analogue switches for semiconductor integrated circuits |
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GB/T 14030-1992 半导体集成电路时基电路测试方法的基本原理(中英文版) General principles of measuring methods of timer circuits for semiconductor integrated circuits |
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GB/T 14031-1992 半导体集成电路模拟锁相环测试方法的基本原理(中英文版) General principles of measuring methods of analogue phase-loop for semiconductor integrated circuits |
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GB/T 14032-1992 半导体集成电路数字锁相环测试方法的基本原理(中英文版) General principles of measuring methods of digital phase-locked loop for semiconductor integrated circuits |
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GB/T 13062-1991 膜集成电路和混合膜集成电路空白详细规范(可供认证用)(中英文版) Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure |
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